JPH0419803Y2 - - Google Patents
Info
- Publication number
- JPH0419803Y2 JPH0419803Y2 JP1482383U JP1482383U JPH0419803Y2 JP H0419803 Y2 JPH0419803 Y2 JP H0419803Y2 JP 1482383 U JP1482383 U JP 1482383U JP 1482383 U JP1482383 U JP 1482383U JP H0419803 Y2 JPH0419803 Y2 JP H0419803Y2
- Authority
- JP
- Japan
- Prior art keywords
- annular portion
- axis
- electronic component
- insulating seal
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 230000001154 acute effect Effects 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 2
- 238000004804 winding Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1482383U JPS59121848U (ja) | 1983-02-02 | 1983-02-02 | 電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1482383U JPS59121848U (ja) | 1983-02-02 | 1983-02-02 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59121848U JPS59121848U (ja) | 1984-08-16 |
| JPH0419803Y2 true JPH0419803Y2 (en]) | 1992-05-06 |
Family
ID=30146168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1482383U Granted JPS59121848U (ja) | 1983-02-02 | 1983-02-02 | 電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59121848U (en]) |
-
1983
- 1983-02-02 JP JP1482383U patent/JPS59121848U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59121848U (ja) | 1984-08-16 |
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